Design and Comparison of Various Passive Components of a 5GHz Wireless LAN Applications

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF( self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material.